1、

The concentration of free cyanide is one of the main control indices for gold extraction liquid of cyanidation. Electrode poisoning is the main difficulty in free cyanide monitoring of cyanidation liguid with silver ion selective electrode. The poisoning ion is determined by electron probe analysis.

游离氰浓度是氰化提金液的主要控制指标之一.用银离子选择电极监测金矿氰化液的游离氰其主要困难在于电极中毒.通过电子探针分析确定了中毒离子;

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2、

The free cyanogen determinator is used to make density analysis of free sodium cyanide in the cyanide leaching solution of gold ore.

游离氰测定仪用于金矿氰化液中的游离氰化钠浓度分析。

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3、

When determine free sodium cyanide in cyanide solution, a positive deviation presents markedly due to dissociation of part complex ions of zinc and copper.

银量法测氰化液中游离氰化钠时铜锌络离子的部分解离造成显著的正偏差。

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4、

The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.

研究了脉冲电镀在微氰镀金,无氰镀金体系中脉冲频率、脉冲占空比对镀金层耐磨性的影响。

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5、

Error Analysis and Concentration control of Free Cyanide in Copper Plating Bath

氰化镀铜液中游离氰化钠的分析误差和含量控制

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6、

In the first 5 hours of leaching, the impure mineral consumed most of free sodium cyanide of the liquor, in that case, the rate of gold leaching is low.

在搅拌浸出最初的5小时内,杂质矿物消耗了溶液中大部分的游离氰化钠,金的浸出率偏低。

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7、

The development history of cyanide-free copper electroplating is briefly reviewed.

简要回顾了无氰碱性镀铜的发展历史.

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8、

Development process and status guo of cyanide free silver plating technology were introduced.

介绍了无氰镀银的发展过程和技术现状.

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9、

The process of cyanide free silver pulse electroplating is investigated in 5, 5-dimethyl hydantoin ( DMH ) bath.

研究了5, 5- 二甲基乙内酰脲 ( DMH ) 无氰脉冲镀银工艺.

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10、

A cyanide free silver electroplating process with 5, 5-dimethyl hydantoin as coordination agent is studied.

研究了5, 5- 二甲基乙内酰脲为配位剂的无氰镀银工艺.

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11、

Basic principle and technology of the cyanide free silver brush plating on copper substrates are researched.

探讨了铜基无氰电刷镀银的基本原理和施镀工艺.

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12、

Ten typical formulas and some kinds of additives used for cyanide-free silver plating were introduced.

综述了十种典型的无氰镀银工艺配方和无氰镀银所采用的添加剂类型.

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13、

A cyanide-free silver electroplating process with 5,5-dimethyl hydantoin as coordination agent is studied.

研究了5,5-二甲基乙内酰脲为配位剂的无氰镀银工艺。

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16、

A cyanide-free alkaline Cu plating process using a strike-to-intermittence two-stage automatic switching power supply was developed.

提出了一种采用冲击镀转间隙镀两级跳自动电源的无氰碱铜工艺.

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